Negative-type Chemically Amplified Photosensitive Novolac

Calibration of Chemically Amplified Resist Models

Direct measurement of the reaction front in chemically amplified photoresists.

The continuing drive by the semiconductor industry to fabricate smaller structures using photolithography will soon require dimensional control at length scales comparable to the size of the polymeric molecules in the materials used to pattern them. The current technology, chemically amplified photoresists, uses a complex reaction-diffusion process to delineate patterned areas with high spatial...

High aspect ratio micro/nano machining with proton beam writing on aqueous developable – easily stripped negative chemically-amplified resists

Proton beam writing (PBW) is a new direct-writing process that uses a focused beam of MeV protons to pattern resist material at nano dimensions. PBW has the unique ability to maintain a straight path through 50 lm thick resist films, and is suitable for high aspect ratio micro(nano)-machining. TADEP resist is a new promising high aspect ratio chemically-amplified resist that can be developed in...

Investigation of Bio-Composites using Novolac Type Liquefied Wood Resin: Effects of Liquefaction and Fabrication Conditions

Wood liquefaction using an organic solvent and an acid catalyst has long been studied as a novel technique to utilize biomass as an alternative to petroleum-based products. Oxalic acid is a weaker organic acid than a mineral acid and wood liquefaction with oxalic acid as a catalyst will result in a higher amount of wood residue than that with a mineral acid. Yet the wood residue can be used as ...

Photosensitive gelatin.

Employing photodestructible surfactants in gelatin-based aqueous gels presents novel possibilities for controlling colloidal and aggregation properties of surfactant gelatin complexes. Light-triggered breakdown of the gelatin-bound photosurfactant aggregates causes dramatic changes in viscosity and aggregation.